This is a very user friend equipment for small production and Laboratory or test run product.
This is highly used in China for the production of LED.
The price is lower than what you can think of when compare with it productivity.
Product Spec
Power Source: 220 V, A/C, +/- 10%, 50Hz
Power usage: Max. 300 W
gold Wire: 20 ~ 50 um (0.8 ~ 2.0 mil)
Bonding Tamp.: 60~400 deg. C
Ultrasonic Power: 2 ways 0~3 W in 2 shifts, tunable
Bonding Time: 2 ways 0~100 ms
Bonding Pressure: 2 ways 35~180 g
1st bond and 2nd Bond distance: 4 mm
Tail length: 2 mm
Gold Ball Size: 2 ~ 4 times of the wire Diameter, tunable
Shortest Bonding time: 0.4 s / wire
Moving area: Diameter 25 mm
Vision System: Microscope or PR Monitor (optional)
Size: 700 (L) x 460 (W) x 550 (H) mm
Weigth: 28 Kg